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Dicing Saw
Dicing is defined as a method which produces
small blocks or dice or the original product.
A dicing saw is a specific saw that
employs a high-speed spindle fitted with an
extremely thin diamond blade to dice, cut,
or groove semiconductor wafers, silicon, glass,
ceramic, crystal, and many other types of material. |
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Thermocarbon has been a producer of high quality dicing saws and high quality dicing blades for over 30 years.
Our product line includes the Tcar 864-1 dicing saw and the Dicemaster® and Blademaster® diamond dicing blades. Our dicing saw products are preferred world-wide because of their precision tolerances, self-sharpening blade characteristics and consistent blade reliability.
Thermocarbon consistently produces high quality saw blades for cutting ceramics such as alumina oxide, alumina nitride, LTCC, HTCC; crystals such as sapphire, lithium niobate, lithium tantalate; other hard and brittle materials such as glass, fused silica, quartz, silicon wafers, garnet, copper, mold compound and epoxy.
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Whether your product is ICs, CSP, MLF, QFN, DFN, BGA, PCB, or MEMS, you will be impressed with our superior cut quality, long blade life, and throughput achieved using our tailor made matrices to cut your substrates.
We strive to make our customer’s dicing process the most efficient and cost effective as possible by providing a broad-based technical program that includes: free research and development, support for third-party vendors for dicing saws or dicing blades, free consultation and free product samples of our dicing blades.
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